LED device and the manufacturing method thereof

ABSTRACT

Disclosed are a LED device and the manufacturing method thereof, the device comprises a LED, which is composed of a LED chip and bonded wires, both connected to a plurality of lead frames and enveloped by a lamp cap, wherein one end of the lead frames emerges from the lamp cap; the plurality of insulating lead wires consist of conductors in the center, and the conductor on one end of the lead wires is connected to said emerged lead frame. Moreover, the insulator of said insulating lead wires is bent to the back and extended sideward; a protective device firmly holds the LED, the electrical connecting portion and the bent insulator positioning portion so as to make the insulator not easily to be released and make the LED device become a safe device.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a LED device and the manufacturing methodthereof, and particularly to a device that is not easily released and isthus safer.

2. Description of the Prior Art

In conventional LED devices such as the one disclosed in the U.S. Pat.No. 6,200,003B1, the light emitting diode is primarily inserted into thesocket, which is then inserted into a case, and connected via twoconducting plates so as to form a lighting structure that is capable ofexhibiting lamp changes. However, such a structure may exhibit lightingeffects only in a single construction. But on the other hand, when it isconnected in series or in parallel, it is often subject to factors suchas the fastening style of its case and socket and the connection of theconnecting plates, thus making it inconvenient when it is connected inseries. Moreover, it cannot achieve a perfect visual appearance and caneasily be released.

In order to overcome the shortcomings inherent in the conventional LEDdevices described above, the present inventor has delved into thismatter with long-time efforts and has come to the realization of thepresent invention.

SUMMARY OF THE INVENTION

Hence, it is an object of the present invention to provide a LED deviceand the manufacturing method thereof, and the overall safety can beenhanced through structures such as a LED, a LED chip, bonded wires,lead frames and an enveloped lamp cap.

The LED device and the manufacturing method thereof according to thepresent invention is an invention wherein the LED device diverges fromits two sides via the insulating lead wires so as to make it even morecompact when it is enveloped with the protective device. Moreover, it iseasier to make the lead wires be connected in series and in parallel andto form any shapes and models.

The LED device and the manufacturing method thereof according to thepresent invention is an invention that can make manufacturingconvenient.

A more complete understanding of these and other features and advantagesof the patent invention will become apparent from a carefulconsideration of the following detailed description of certainembodiments illustrated in the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A and FIG. 1B are the first cross-sectional perspective views ofthe present invention.

FIG. 2 is the second cross-sectional perspective view of the presentinvention.

FIG. 3A and FIG. 3B are solid perspective views showing thedecomposition of the present invention.

FIG. 4 is a perspective view showing the first embodiment of the presentinvention.

FIG. 5 illustrates the second embodiment of the present invention.

FIG. 6 is a perspective view showing the third embodiment of the presentinvention.

FIG. 7A˜FIG. 7D is the first flowchart showing the first embodiment ofthe manufacturing of the present invention.

FIG. 8A˜FIG. 8F is the second flowchart showing the second embodiment ofthe manufacturing of the present invention.

FIG. 9 is the third flowchart showing the third embodiment of themanufacturing of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

As shown in FIG. 1A, the LED device 1 in the present invention iscomposed of a LED light bulb, insulating lead wires and protectivedevices; two lead frames 21, 22 are installed on the LED light bulb, andthe lower end of the two lead frames 21, 22 form an electricalconnecting portion respectively, wherein a LED clip 3 installed on thetop of one of the lead frame 21 and the LED chip 3 is then connected toanother lead frame 22 via bonded wires 31, and a lamp cap 4 is installedon the exterior so that the electrical connecting portion 20 on thelower end of the two lead frames 21 and 22 emerges from the lamp cap 4.

The insulating end on the top end of the insulating lead wires 11 and 12is bent to the back and extended sideward so as to form an opening 13 insuch a way that the conductor 14 in the center is connected to theelectrical connecting portion 20 on the lower end of said lead frames 21and 22.

The protective device 5 envelops the LED light bulb, the electricalconnecting portion and the opening 13 formed by the backward bending andthe sideward extension of the top of the insulating lead wires so as toachieve a safe device that is not easily released from the insulatinglead wires and the electrical connecting portion.

Said lamp cap 4 can be made of plastics or transparent, semi-transparentor added with fluorescent substances; an insulating positioning bracket41 is installed on the lower end of the lead frames 21 and 22 so as tofirmly fix its position; the insulating lead wires connected on thelower end of the LED light bulb can be two or multiple in number, andparallel to one another or be in a predetermined angle (for example, ata right angle or in a straight line at 180°); the connection between theconductor of the lead wire 14 and the lead frames 21 and 22 call bewelded or pressure bonded; the protective device 5 can also betransparent, semi-transparent or added with fluorescent substances, andcan also envelop the entirety or parts of the LED light bulb.

Referring to FIG. 1B, this is another embodiment of the presentinvention wherein the insulating lead wires 11A and 12A are connected instraight lines at 180° to the two sides.

Referring to FIG. 2, this is another embodiment of the present inventionwherein the protective devices 5A and 5B as shown can be predeterminedfrom different shapes, for example, regular or irregular shapes, flat orconvex/concave so as to make the overall LED device be enveloped byplastics.

The LED device of the present invention as shown in FIG. 3A and FIG. 3Bcan be enveloped by two enveloping plates 51 and 52 on the top and thebottom like the protective devices as shown in FIGS. 1A, 1B, and 2 so asto envelop the light emitting element 6 wherein the enveloping plates 51and 52 are concave-shaped hollows with their hollow pail 50 in theinterior, and the two ends of the enveloping plates form an opening 53respectively so as to install the insulating lead wires. Moreover, thebent part (that is the branching off part) of the insulation of theinsulating lead wires tightly locked by the internal border locks andthe lock 51 formed in the periphery of the connection are firmly fixedby joining or gluing so as to make them not easily become released. Theembodiment of the LED device of the present invention as shown in FIG. 4can be composed of a plurality of LED light emitting elements 1A, whichconsists of electrodes and a plurality of electrodes, which areconnected by a plurality of insulating lead wires in such a way that theinsulating ends on the top of insulating lead wires are bent to the backand extended sideward to form an opening so that the conductor in thecenter connects to the electrode on the chip base of different LED lightemitting elements.

The protective device 5 envelops the entirety or parts of the lightemitting elements, different electrical connecting portions and theopening formed by the backward bending and the sideward extension of thetop of the insulating lead wires and can be connected in series,parallel or series-parallel in accordance with the directionality of theLED.

A power supply device is composed of a plug 71 and a socket 70, whichconnects to the lighting set so as to form predetermined functions,words, figures or shapes.

Said light emitting elements can be of the same or different functionsand can be of the same or different colors.

A plurality of LED light emitting elements can also be connected instrings as shown in the figure or connected in arrays as shown in FIG.5. When they are connected in arrays, the LED should be made indifferent arrangements such as squares, rhombuses, or triangles and canalso form into a network shape or a curtain type, or a two-plate shape.

Moreover, said power supply devices can connect to a function controller72 so as to form predetermined functions.

FIG. 6 shows different LED devices are connected in rhombuses, and theintersecting LED light emitting elements 6A and 6B in their interiorconnect to the different light emitting elements 6A and 6B viainsulating lead wires. Regarding the manufacturing method of the LEDdevice of the present invention, the LED device consists of the LEDlight bulb, lead frames, insulating lead wires and protective devices,and the steps for their manufacturing are as follows:

First separate the top of the insulating lead wires 81 and 82 into atleast two plates so as to form a branching off part 80 so that theconductor 83 (as shown in FIG. 7A) is exposed; properly make two leadframes 84, 85, and an electrical connecting portion 841 is formed on thelower end so that a LED chip 86 is installed on the top of one of thelead frames 84, and a lamp cap 87 is then installed on the exterior, andthe lower end of the lamp cap forms a flange 871 (as shown in FIG. 7B);the emerged conductor 83 and the lead frames 84, 85 are electricallyconnected to the electrical connecting portion 841 and the lead wires(as shown in FIG. 7C); a protective device 88 envelops the lower end ofthe lamp cap and the electrical connecting portion and is firmly fixedby lead wires 81 and 82 (as shown in FIG. 7D). The protective device canbe made by plastics or enveloped from multiple combinations. For anothermanufacturing method, the opening at the top of the insulating leadwires 81A and 82A emerges from the conductor 83 (as shown in FIG. 8A).Moreover, properly make the LED light emitting element 80A, on whichlead frames 84 and 85 are installed, and an insulating positioningbracket is installed on the LED light emitting elements 84A and 85A,wherein a LED chip 86A is installed on one of the lead frames 84A, andconnected to another lead frame 85A via bonded wires (as shown in FIG.8B); the emerged conductor 83A is electrically connected to the leadframes 84A and 85A (as shown in FIG. 8C), then inserted the insulatingpositioning bracket 872A as shown in FIG. 8D, and coupled the flange871A on the lower end of the enveloping plates and the insulatingpositioning bracket 872A of the lead frame, and finally enveloped andpositioned by the protective device 88A (as shown in FIG. 8F.)

For another manufacturing method, as shown in FIG. 9, a LED chip base 91is installed, and the first electrode 91A and the second electrode 91Bare installed on the LED chip base wherein a LED chip 92 is installed onthe first electrode 91A. After the LED chip 92 has been installed on thefirst electrode 91A, then the LED chip 92 is electrically connected tothe second electrode 91B via bonded wires. After the overall structurehas been assembled, an insulating lead wire 94 and 95 is installed onthe first electrode 91A and the second electrode 91B respectively andthen the front end of the insulating lead wires 94 and 95 branches offto form an opening 951 so as to expose the conductor 96; then theemerged conductor 96 is electrically connected to the first electrode91A and the second electrode 91B, and then enveloped by the envelopingplates 97 and 98 in the top and the bottom in the hollow in the interiorso as to form an overall structure. It can also be enveloped and fixedby the protective device of plastic materials.

From the above, the LED device and the manufacturing method of thepresent invention can definitely be safer and effective when it is used,and such effects can definitely improve the weaknesses inherent in theconventional LEDs. Moreover, the invention has not yet been publiclydisclosed and used. Hence, the present invention is deemed to complywith conditions for approvable patents stipulated by Patent Law. Wesincerely hope that the present invention can be allowed forregistration.

Although the invention has been described in terms of preferredembodiments, it is apparent that numerous variations and modificationsmay be made without departing from the true spirit and scope thereof, asset forth in the following claims.

1. A LED device comprises: a LED light bulb consisting of a LED chip,bonded wires, both connected to a plurality of lead frames and envelopedby a lamp cap, and one end of the lead frames emerges from the lamp cap;a plurality of insulating lead wires consist of conductors in thecenter; the conductor on one end of said lead wire is connected to saidemerged lead frame, and said insulator of said insulating lead wire isbent to the back and extended sideward; a protective device for holdingsaid LED light bulb, the electrical connecting portion and a bentinsulator positioning portion to make said insulator not easily bereleased such that this becomes a safe device.
 2. The LED device asclaimed in claim 1, wherein said lamp cap consists of flanges so as toconnect and position to said protective device.
 3. The LED device asclaimed in claim 1, wherein said lamp cap is made of plastics.
 4. TheLED device as claimed in claim 1, wherein said lamp cap is transparent,semi-transparent, or added with fluorescent materials.
 5. The LED deviceas claimed in claim 1, wherein an insulating positioning bracket isinstalled on said plurality of lead frames so as to firmly fix said leadframes.
 6. The LED device as claimed in claim 1, wherein said pluralityof insulating lead wires and said LED light bulb are connected togetherin a form that a plurality of insulating lead wires are parallel.
 7. TheLED device as claimed in claim 1, wherein said pluality of insulatinglead wires and said LED light bulb are connected together in apredetermined angle.
 8. The LED device as claimed in claim 8, whereinsaid predetermined angle is a right angle or 180° to make saidinsulating lead wires form into straight lines.
 9. The LED device asclaimed in claim 1, wherein said conductor and said lead frames areelectrically connected by welding or pressure bonding.
 10. The LEDdevice as claimed in claim 1, wherein said protective device istransparent, semi-transparent or added with fluorescent materials. 11.The LED device as claimed in claim 1, wherein said protective deviceholds the entirety or parts of said LED light bulb.
 12. The LED deviceas claimed in claim 1, wherein said protective device is made of apredetermined shape, in regular or irregular shape, or flat orconvex/concave.
 13. The LED device as claimed in claim 1, it is anenveloped by plastics.
 14. The LED device as claimed in claim 1, whereinsaid protective device is enveloped by a plurality of enveloping platesso as to form a hollow construction.
 15. The LED device as claimed inclaim 1, wherein openings are reserved on said plurality of envelopingplates so as to install insulating lead wires.
 16. The LED device asclaimed in claim 1, wherein said plurality of enveloping plates are usedwith internal border tightly to lock the bent part of said insulator soas not to be easily released.
 17. The LED device as claimed in claim 1,wherein said plurality of enveloping plates are firmly fixed by joiningor gluing.
 18. A LED device comprising: light emitting elements whichconsist of at least two predetermined electrodes on the LED chip base,and at least a LED chip is fixed on said LED chip base and connected toone of said electrodes, and two ends of bonded wires are connected tosaid LED chip and another electrode; a plurality of insulating leadwires having conductors in the center, and one end of said lead wires isconnected to said electrode on the chip base, and moreover, theinsulating end of said insulating lead wires are bent to the back andextended sideward; and a protective device for holding said lightemitting elements, electrical connecting, portion and the bent insulatorpositioning portion so as to make them not easily be released and becomea safe device.
 19. The LED device as claimed in claim 18, wherein aplurality of LED chips are installed on said base in the same ordifferent directions.
 20. The LED device as claimed in claim 18, whereina plurality of insulating lead wires and LED light bulb are connectedtogether in a form that a plurality of insulating lead wires areparallel.
 21. The LED device as claimed in claim 18, wherein a pluralityof insulating lead wires and LED light bulb are connected together in apredetermined angle.
 22. The LED device as claimed in claim 21 whereinsaid predetermined angle is a right angle or 180° to make saidinsulating wires in a straight line.
 23. The LED device as claimed inclaim 18, wherein said insulator and said lead frames are electricallyconnected by welding or pressure bonding.
 24. The LED device as claimedin claim 18 wherein said protective device is transparent,semi-transparent, or added with fluorescent materials.
 25. The LEDdevice as claimed in claim 18 wherein said protective device is made ofa predetermined shape, in regular or irregular shape, and flat orconvex/concave.
 26. The LED device as claimed in claim 18, it isenveloped by plastics.
 27. The LED device as claimed in claim 18,wherein said protective device is enveloped by a plurality of envelopingplates to form a hollow construction.
 28. The LED device as claimed inclaim 18 wherein openings are reserved on a plurality of envelopingplates so as to install insulating lead wires.
 29. The LED device asclaimed in claim 18 wherein said plurality of enveloping plates are usedwith internal border tightly to lock the bent part of said insulator soas not to be easily released.
 30. The LED device as claimed in claim 18,wherein a plurality of enveloping plates are firmly fixed by joining orgluing.
 31. A LED device comprising: a plurality of LED light emittingelements having a plurality of connecting electrodes: a plurality ofinsulating lead wires having conductors in the center, and one end ofsaid lead wires is connected to said electrode, on the chip base, andthe insulating end of said insulating lead wires is bent to the back orextended sideward; a protective device for holding the entirety or partsof said light emitting elements, different electrical connecting portionand an opening formed by the backward bending and the sideward extensionof the top of said insulating lead wires and can be connected in series,parallel or series-parallel in accordance with the directionality of theLED; and a power supply device connected in series to form predeterminedfunctions, words, figures or shapes.
 32. The LED device as claimed inclaim 31, wherein a plurality of LED light emitting elements are of thesame or different functions, and in the same or different color.
 33. TheLED device as claimed in claim 31, wherein said plurality of LED lightemitting elements are connected in strings.
 34. The LED device asclaimed in claim 31, wherein said plurality of LED light emittingelements are connected in arrays.
 35. The LED device as claimed in claim34, wherein said arrays are made in different arrangements such assquares, rhombuses, or triangles.
 36. The LED device as claimed in claim34, wherein said arrays can also be formed into a network shape or acurtain type.
 37. The LED device as claimed in claim 35, wherein saidarrays can also be formed into a network shape or a curtain type. 38.The LED device as claimed in claim 34, wherein said arrays are made in atwo-plate shape.
 39. The LED device as claimed in claim 31, wherein saidpower supply device is connected by a plug and a socket.
 40. The LEDdevice as claimed in claim 31, wherein said power supply device has afunction controller so as to form predetermined functions.
 41. A methodfor manufacturing a LED device comprising a LED light bulb and aplurality of emerged lead frames; insulating lead wires consist ofconductors in the center and a protective device, the method includesthe following steps: A. Separating the end of said insulating lead wiresinto at least two plates so as to expose said conductor; B. Electricallyconnecting said emerged conductor to said lead frames of said LED lightbulb, and bending said insulator of said lead wires to the back andextended sideward. C. Holding said LED light bulb, electrical connectingportion and insulating part positioning by said protective device. 42.The LED device as claimed in claim 41, wherein said protective device ismade from plastics.
 43. The LED device as claimed in claim 41 whereinsaid protective device is formed by a plurality of enveloping plates.44. The method for manufacturing a LED device comprising a LED chipbase, which consists of at least two predetermined electrodes; at leasta LED chip, bonded wires; insulating lead wires having conductors in thecenter; and a protective device, the method includes the followingsteps: A. Fixing said LED chip on said LED chip base and electricallyconnecting to one of said electrodes; B. Electrically connecting twoends of bonded wires respectively to said LED chip and anotherelectrode; C. Separating the end of said insulating lead wires so as toexpose said conductor in its center; D. Electrically connecting saidexposed conductor to said LED light bulb, and bending said insulator ofsaid insulating lead wires to the back and extended sideward; E. Holdingsaid LED chip and its base, bonded wires, electrical connecting portionand said bent insulator by said protective device.
 45. The LED device asclaimed in claim 44, wherein said protective device is made fromplastics.
 46. The LED device as claimed in claim 44, wherein saidprotective device is formed by a plurality of enveloping plates.